US 12,289,547 B2
Dynamic vision sensor imaging device
Kazutoshi Kodama, Tokyo (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 18/000,655
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jun. 4, 2021, PCT No. PCT/JP2021/021302
§ 371(c)(1), (2) Date Dec. 2, 2022,
PCT Pub. No. WO2021/256290, PCT Pub. Date Dec. 23, 2021.
Claims priority of application No. 2020-105876 (JP), filed on Jun. 19, 2020.
Prior Publication US 2023/0224605 A1, Jul. 13, 2023
Int. Cl. H04N 25/707 (2023.01); H04N 25/773 (2023.01); H04N 25/79 (2023.01)
CPC H04N 25/707 (2023.01) [H04N 25/773 (2023.01); H04N 25/79 (2023.01)] 20 Claims
OG exemplary drawing
 
1. An imaging device, comprising:
a stacked chip structure formed by stacking at least two semiconductor chips including a first-layer semiconductor chip and a second-layer semiconductor chip,
wherein the first-layer semiconductor chip is provided with a pixel array unit in which an event pixel that detects a phenomenon in which an amount of change in luminance of a pixel exceeds a predetermined threshold value as event occurrence and outputs an event detection signal, and a gradation pixel that outputs a pixel signal at a gradation level according to an amount of incident light are mixed, and
the second-layer semiconductor chip is provided with an analog front-end unit for an event pixel that processes the event detection signal and with an analog front-end unit for a gradation pixel that processes the pixel signal, corresponding to each of the event pixel and the gradation pixel,
wherein four event pixels are defined as an event pixel unit,
wherein the analog front-end unit for the event pixel unit is provided under the event pixel unit and has a same shape as a shape of the event pixel unit on a one-to-one basis, and
wherein the analog front-end unit for the gradation pixel is provided under the gradation pixel and has a same shape as a shape of the gradation pixel on a one-to-one basis.