US 12,289,089 B2
Acoustic wave device with enhanced quality factor and fabrication method thereof
Chin-Chia Chang, Taipei (TW); Shih-Meng Lin, Taipei (TW); and Shih-Che Chen, Taipei (TW)
Assigned to RichWave Technology Corp., Taipei (TW)
Filed by RichWave Technology Corp., Taipei (TW)
Filed on Jun. 26, 2022, as Appl. No. 17/849,698.
Claims priority of application No. 111113179 (TW), filed on Apr. 7, 2022.
Prior Publication US 2023/0327629 A1, Oct. 12, 2023
Int. Cl. H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/145 (2006.01)
CPC H03H 3/08 (2013.01) [H03H 9/02992 (2013.01); H03H 9/14547 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An acoustic wave device comprising:
a piezoelectric substrate having a surface; and
a transducer disposed on the surface of the piezoelectric substrate, the transducer comprising:
a first electrode extending along a first direction and having a first end;
a second electrode extending along the first direction and having a second end, the second electrode and the first electrode being spaced apart along a second direction; and
a plurality of first protrusions disposed at the first end of the first electrode, the plurality of first protrusions extending along the first direction and partially obstructing the first end.