US 12,288,835 B2
Electronic device comprising an optical chip and method of fabrication
Nicolas Mastromauro, Lumbin (FR); and Karine Saxod, Les Marches (FR)
Assigned to STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed by STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed on Jan. 11, 2021, as Appl. No. 17/145,929.
Application 17/145,929 is a division of application No. 16/572,979, filed on Sep. 17, 2019, granted, now 10,923,638.
Claims priority of application No. 1858736 (FR), filed on Sep. 25, 2018.
Prior Publication US 2021/0135072 A1, May 6, 2021
Int. Cl. H01L 33/58 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/58 (2013.01) [H01L 33/483 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A method of fabricating an electronic device, comprising:
providing a carrier substrate having a front face on which is mounted at least one electronic chip comprising an optical component;
providing an encapsulation cover having a front opening;
mounting an optical element through which light is able to pass on the encapsulation cover in front of the front opening;
mounting an additional mask on the encapsulation cover in front of the optical element, wherein the additional mask has a local opening;
mounting the encapsulation cover, with the optical element and the additional mask mounted thereon, on top of the front face of the carrier substrate to enclose the at least one electronic chip situated in a chamber bounded by the encapsulation cover and with the optical element arranged in front of the optical component, wherein optical axes of the optical component and the optical element are aligned with an axis of the local opening of the additional mask;
wherein mounting the encapsulation cover comprises:
placing the encapsulation cover in a reference position;
detecting a positioning pattern located on the optical element between a central region and an edge of the front opening of the encapsulation cover, through the front opening with respect to a position of the carrier substrate;
starting from the reference position, moving the encapsulation cover on top of the carrier substrate to a mounting position; and
mounting the encapsulation cover at the mounting position to the top of the carrier substrate.