| CPC H01L 27/0207 (2013.01) [G06F 30/392 (2020.01); H01L 21/26513 (2013.01); H01L 21/74 (2013.01); H01L 21/76898 (2013.01); H01L 21/823892 (2013.01); H01L 23/481 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 27/0928 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01)] | 20 Claims |

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1. A method of manufacturing an integrated circuit (IC) structure, the method comprising:
configuring each of an n-well and a p-well in a first IC die to have a first portion extending in a first direction and second and third portions extending from the first portion in a second direction perpendicular to the first direction; and
forming IC devices comprising a first pickup structure electrically connected to the n-well and a second pickup structure electrically connected to the p-well,
wherein the forming the IC devices comprises forming a PMOS transistor in the second or third portion of the n-well and forming an NMOS transistor in the second or third portion of the p-well.
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