US 12,288,769 B2
Micro-LED mounting substrate, micro-led display, and method of manufacturing micro-LED mounting substrate
Yoshiyuki Harumoto, Sakai (JP); and Yoshito Hashimoto, Sakai (JP)
Assigned to SHARP KABUSHIKI KAISHA, Sakai (JP)
Filed by SHARP KABUSHIKI KAISHA, Sakai (JP)
Filed on Apr. 18, 2022, as Appl. No. 17/722,831.
Claims priority of application No. 2021-077116 (JP), filed on Apr. 30, 2021.
Prior Publication US 2022/0352118 A1, Nov. 3, 2022
Int. Cl. H01L 29/18 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01); H10H 20/01 (2025.01)
CPC H01L 24/95 (2013.01) [H01L 24/81 (2013.01); H01L 25/0753 (2013.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01); H01L 24/16 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81141 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/95136 (2013.01); H10H 20/034 (2025.01); H10H 20/0364 (2025.01)] 8 Claims
OG exemplary drawing
 
1. A micro-light-emitting diode (micro-LED) mounting substrate comprising:
a wiring line substrate including a pair of main surfaces, and provided with at least a plurality of substrate-side connecting portions on one main surface of the pair of main surfaces;
a plurality of micro-LEDs disposed side by side on the one main surface of the wiring line substrate, each of the plurality of micro-LEDs including at least a light-emitting face and an LED-side connecting portion provided on a surface opposite the light-emitting face and electrically connected to a corresponding substrate-side connecting portion in the plurality of substrate-side connecting portions;
a first positioning portion provided on the surface opposite the light-emitting face of at least one of the plurality of micro-LEDs; and
a second positioning portion provided on the one main surface of the wiring line substrate and capable of positioning the at least one of the plurality of micro-LEDs including the first positioning portion by being recess-projection-fitted to the first positioning portion,
wherein the first positioning portion is provided separately from the LED-side connecting portion, and
the second positioning portion is provided separately from the substrate-side connecting portion.