| CPC H01L 24/37 (2013.01) [H01L 2224/3755 (2013.01); H01L 2924/13055 (2013.01)] | 11 Claims |
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1. A semiconductor device comprising:
a semiconductor element including:
a plurality of first main electrodes disposed on a first main surface;
a second main electrode disposed on a second main surface opposite to the first main surface in a plate thickness direction; and
a protective film disposed on the first main surface and having at least one interposed film portion disposed between the plurality of first main electrodes;
a conductive member having a facing surface facing the first main surface in the plate thickness direction and having, on the facing surface:
a plurality of facing portions each facing a corresponding one of the plurality of first main electrodes in the plate thickness direction; and
at least one interposed conductive portion disposed between the plurality of facing portions in an arrangement direction in which the plurality of facing portions are arranged, wherein the at least one interposed conductive portion has a plurality of recesses; and
a plurality of solder portions disposed between the plurality of first main electrodes and the plurality of facing portions, the plurality of solder portions being separated away from each other by the at least one interposed film portion and the at least one interposed conductive portion to define a space between the plurality of solder portions, wherein
the at least one interposed film portion has lower wettability to the plurality of solder portions than the plurality of first main electrodes have, and the at least one interposed conductive portion has lower wettability to the plurality of solder portions than the plurality of facing portions have such that the at least one interposed film portion and the at least one interposed conductive portion avoid the plurality of solder portions in liquid phase entering into the space during soldering.
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