US 12,288,751 B2
Microelectronic assemblies
Aleksandar Aleksov, Chandler, AZ (US); and Johanna M. Swan, Scottsdale, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Aug. 17, 2023, as Appl. No. 18/451,156.
Application 18/451,156 is a continuation of application No. 17/701,845, filed on Mar. 23, 2022, granted, now 11,769,734.
Application 17/701,845 is a continuation of application No. 16/648,332, granted, now 11,335,641, issued on May 17, 2022, previously published as PCT/US2017/068912, filed on Dec. 29, 2017.
Prior Publication US 2023/0395518 A1, Dec. 7, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01)
CPC H01L 23/5386 (2013.01) [H01L 23/13 (2013.01); H01L 23/3675 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 24/17 (2013.01); H01L 25/0652 (2013.01); H01L 25/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A microelectronic assembly, comprising:
a package substrate including:
a dielectric material having a first surface and an opposing second surface;
a first material on at least a portion of the second surface;
a second material on at least a portion of the first material, wherein the second material has a different material composition than the first material;
first conductive contacts and second conductive contacts;
first openings through the first material and the second material exposing the first conductive contacts; and
second openings through the first material exposing the second conductive contacts;
a first die conductively coupled to at least some of the first conductive contacts;
a second die conductively coupled to the second conductive contacts, wherein the first die extends at least partially over the second die, wherein the second die has a first surface and an opposing second surface, conductive contacts at the first surface of the second die are conductively coupled to the second conductive contacts, and conductive contacts at the second surface of the second die are conductively coupled to conductive contacts of the first die; and
a third die conductively coupled to at least some of the first conductive contacts, wherein conductive contacts at the second surface of the second die are conductively coupled to conductive contacts of the third die.