US 12,288,717 B2
Metal based hydrogen barrier
Srinivas Gandikota, Santa Clara, CA (US); Steven C. H. Hung, Sunnyvale, CA (US); Srinivas D. Nemani, Saratoga, CA (US); Yixiong Yang, Fremont, CA (US); Susmit Singha Roy, Campbell, CA (US); and Nikolaos Bekiaris, Campbell, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Feb. 20, 2024, as Appl. No. 18/581,598.
Application 18/581,598 is a division of application No. 17/587,525, filed on Jan. 28, 2022, granted, now 12,020,982.
Application 17/587,525 is a division of application No. 16/876,293, filed on May 18, 2020, abandoned.
Claims priority of provisional application 62/852,363, filed on May 24, 2019.
Prior Publication US 2024/0194526 A1, Jun. 13, 2024
Int. Cl. H01L 21/768 (2006.01); H01L 23/48 (2006.01)
CPC H01L 21/76864 (2013.01) [H01L 21/76898 (2013.01); H01L 23/481 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A processing tool comprising:
a central transfer station comprising at least one robot configured to move a wafer;
a plurality of process stations, each process station connected to the central transfer station and providing a processing region separated from processing regions of adjacent process stations, the plurality of process stations comprising a metal liner deposition chamber, a metal cap deposition chamber, and an annealing chamber; and
a controller connected to the central transfer station and the plurality of process stations, the controller configured to activate the robot to move the wafer between process stations, including:
depositing a metal liner on the wafer in the metal liner deposition chamber,
depositing a metal cap directly on the metal liner in the metal cap deposition chamber, and
exposing the wafer to an anneal process in the annealing chamber.