| CPC H01L 21/681 (2013.01) | 4 Claims |
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1. A wafer calibration method for a wafer calibration device including the steps of:
a. providing a base frame (1) in the wafer calibration device;
b. providing the base frame (1) with a posture adjustment mechanism and an optical calibration device (5) corresponding to the posture adjustment mechanism, wherein the posture adjustment mechanism is driven with a vacuum suction cup (44) for receiving a wafer (6);
c. providing the optical calibration device (5) with an emitter (52) and a receiver (53) arranged on one side of the vacuum suction cup (44), and a detection area reserved between the emitter (52) and the receiver (53);
d. the optical calibration device (5) detects the shading distance of the wafer (6) received by the vacuum suction cup (44) in the detection area relative to the optical calibration device (5);
e. the posture adjustment mechanism drives the vacuum suction cup (44) to move the wafer (6) received by the vacuum suction cup (44) relative to the detection area back and forth and up and down;
f. the posture adjustment mechanism includes a displacement mechanism arranged on the base frame (1), wherein the displacement mechanism includes a linear driving device (2) arranged on the base frame (1), and the linear driving device (2) is driven to be provided with a lifting driving device (3);
g. the lifting trajectory of the lifting driving device (3) and the driving trajectory of the linear driving device (2) form a vertical coordinate system;
h. the posture adjustment mechanism also includes a rotary driving device (4) driven to be arranged on the displacement mechanism;
i. the rotary driving device (4) is arranged on the lifting driving device (3), and the rotary driving device (4) is driven to be provided with the vacuum suction cup (44);
j. the posture adjustment mechanism also includes a plurality of support pins (14) arranged on the base frame (1), and the plurality of support pins (14) are distributed around the periphery of the vacuum suction cup (44);
k. the linear driving device (2) is installed on the base frame (1) through a base (11), wherein the linear driving device (2) includes a first screw rod (21); and the first screw rod (21) is axially horizontally placed, and both ends of the first screw rod (21) are respectively installed on the base (11) through a first bearing seat (22), a first motor (23) is drivingly connected to the first screw rod (21) through a coupling (25), and the first motor (23) is fixed on the base (11) through a first motor seat (26);
l. Providing a first nut seat (27) that is connected to a first transition connecting block (28), and the first transition connecting block (28) is fixed on a sliding seat, the sliding seat includes a lower connecting plate (210), and a right connecting plate (29) and a left connecting plate (211) are arranged at intervals on the lower connecting plate (210), the lower connecting plate (210) is slidably arranged on a first linear guide rail (24), the first linear guide rail (24) is arranged on the base (11), and the left connecting plate (211) and the right connecting plate (29) are fixedly connected through a connecting rib (212);
m. the lifting driving device (3) is arranged on the left connecting plate (211) and the right connecting plate (29);
n. the lifting driving device (3) includes a second screw rod (31), and the second screw rod (31) is axially vertically placed, and both ends of the second screw rod (31) are respectively arranged on the left connecting plate (211) through a second bearing seat (32);
o. a second motor (33) is installed on the right connecting plate (29) through a second motor seat (36) and a first connecting bent plate (37), the second motor (33) is drivingly connected with a first synchronous pulley (38), the second screw rod (31) is drivingly connected with a second synchronous pulley (39), the second synchronous pulley (39) is drivingly connected with the second motor (33) through a first synchronous belt (34), a second nut seat (310) is connected with a lifting platform (312) through a second transition connecting block (311), one side of the lifting platform (312) is drivingly installed on the left connecting plate (211) through a second linear guide rail (35), and the other side of the lifting platform (312) is slidably connected with a third linear guide rail (315) arranged on the right connecting plate (29) through a beam (313) and an auxiliary sliding plate (314);
p. the rotary driving device (4) is installed on the lifting platform (312);
q. the rotary driving device (4) includes a third motor (41), the third motor (41) is arranged on the lifting platform (312) through a third motor seat (45) and a second connecting bent plate (46), a support block (47) is fixed on the beam (313), a rolling bearing (48) is coaxially installed on the support block (47) and the beam (313), a rotating shaft (43) is drivingly connected to the rolling bearing (48), a third synchronous pulley (49) is drivingly connected to the rotating shaft (43), the third synchronous pulley (49) is drivingly connected with a fourth synchronous pulley (410) drivingly connected to the third motor (41) through a second synchronous belt (42), the rotating shaft (43) is a hollow shaft, a rotary joint (411) is installed at the lower end of the rotating shaft (43), and the vacuum suction cup (44) is fixedly installed at the upper end of the rotating shaft (43);
r. wherein the wafer calibration device wafer calibration method further includes the following steps:
i. Step S1, obtaining the wafer (6), the step includes: the vacuum suction cup (44) moves to the original position (I) to obtain the wafer (6);
ii. Step S2, detecting the posture of the wafer (6), the step includes: the posture adjustment mechanism drives the wafer (6) to move to the detection position, the optical calibration device (5) on one side of the posture adjustment mechanism detects the shading distance of the wafer (6) at the optical calibration device (5), and calculates the position deviation of the wafer (6) on the vacuum suction cup (44) of the wafer calibration device through a calibration algorithm;
iii. Step S3, calibrating the posture of the wafer (6), the step includes: the linear driving device (2) and the lifting driving device (3) of the posture adjustment mechanism drive the wafer (6) to move, and the rotary driving device (4) drives the wafer (6) to rotate;
iv. Step S4, calibrating the center (P) of the wafer; the step includes: transferring and adjusting the position of the wafer (6) between the support pins (14) and the vacuum suction cup (44), so that the center (O) of the vacuum suction cup coincides with the center (P) of the wafer;
v. Step S5, resetting the wafer (6) after calibrating the center (P) of the wafer; the step includes: placing the wafer (6) after calibrating the center (P) of the wafer on the support pins (14), and positioning the center (P) of the wafer at the original position (I); wherein the step of obtaining the wafer (6) by the vacuum suction cup (44) moving to the original position (I) further includes:
i. the wafer (6) is placed on the support pins (14), the first motor (23) of the linear driving device (2) drives the first nut seat (27) to move to the original position (I) along the linear direction of the ρ axis;
ii. the second motor (33) of the lifting driving device (3) drives the second screw rod (31) to rotate, the second screw rod (31) drives the second nut seat (310) to drive the lifting platform (312) to move the rotary driving device (4) along the lifting direction Z, and the vacuum suction cup (44) lifts the wafer (6) from the support pins (14) to the working height (III) during the movement process;
iii. the rotary joint (411) of the rotary driving device (4) is connected to the vacuum pump, the vacuum pump works, and a negative pressure is generated between the vacuum suction cup (44) and the wafer (6), using atmospheric pressure to adsorb the wafer (6) on the vacuum suction cup (44), thereby obtaining the wafer (6).
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