US 12,288,711 B2
Methods of operating die attach systems
Alain De Bock, Neerpelt (BE); and René Bouman, Vught (NL)
Assigned to Assembleon B.V., Eindhoven (NL)
Filed by Assembléon B.V., Eindhoven (NL)
Filed on Jan. 3, 2023, as Appl. No. 18/092,546.
Application 18/092,546 is a division of application No. 16/561,224, filed on Sep. 5, 2019, granted, now 11,574,832.
Claims priority of provisional application 62/727,447, filed on Sep. 5, 2018.
Prior Publication US 2023/0148420 A1, May 11, 2023
Int. Cl. H01L 21/68 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 23/544 (2006.01)
CPC H01L 21/681 (2013.01) [H01L 21/67144 (2013.01); H01L 23/544 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 2224/75001 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75755 (2013.01); H01L 2224/83132 (2013.01); H01L 2224/8318 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method of operating a die attach system, the method comprising steps of:
providing the die attach system, the die attach system including (i) a verification substrate configured to receive a plurality of die, the verification substrate including a plurality of substrate reference markers, (ii) an imaging element, (iii) a bond tool configured to contact each of the plurality of die during a transfer from a die supply source to the verification substrate, and (iv) a supply support for supporting the die supply source, the die supply source being positioned between the bond tool and the verification substrate;
imaging each of the plurality of die with respective ones of the plurality of substrate reference markers in a single field-of-view using the imaging element from the die attach system; and
determining an alignment of the plurality of die with the verification substrate using an image taken during imaging of each of the plurality of die with respective ones of the plurality of substrate reference markers.