US 12,288,704 B2
Methods and apparatus for processing a substrate
Ralph P. Antonio, Santa Clara, CA (US); Lee Guan Tay, Singapore (SG); Peter Lai, Santa Clara, CA (US); Sudhir R. Gondhalekar, Fremont, CA (US); Tzu-Fang Huang, San Jose, CA (US); and Jeffrey Hudgens, Santa Clara, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Nov. 18, 2022, as Appl. No. 17/989,980.
Prior Publication US 2024/0170311 A1, May 23, 2024
Int. Cl. H01L 21/67 (2006.01); B25J 9/16 (2006.01); B25J 11/00 (2006.01); B25J 13/08 (2006.01); B25J 19/02 (2006.01); G01S 17/89 (2020.01); H01L 21/677 (2006.01)
CPC H01L 21/67259 (2013.01) [B25J 9/161 (2013.01); B25J 11/0095 (2013.01); B25J 13/088 (2013.01); B25J 19/021 (2013.01); G01S 17/89 (2013.01); H01L 21/67742 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate, comprising:
a transfer robot configured to position a substrate on a substrate support disposed within an interior of a processing chamber configured to process the substrate; and
a sensor disposed on the transfer robot, operably connected to a controller of the processing chamber, and configured with an angle of view to provide in-situ continuous closed loop feedback relating to spatial information of the interior of the processing chamber to the controller.