US 12,288,701 B2
Multi-chamber semiconductor manufacturing system
Hsueh-Hsien Wu, Hsinchu (TW); Chih-Yuan Chan, Hsinchu County (TW); and Yi-Ting Lai, Hsinchu County (TW)
Assigned to SYSKEY TECHNOLOGY CO., LTD., Hsinchu County (TW)
Filed by Syskey Technology Co., Ltd., Hsinchu County (TW)
Filed on Feb. 28, 2022, as Appl. No. 17/682,457.
Prior Publication US 2023/0274958 A1, Aug. 31, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67196 (2013.01) [H01L 21/67167 (2013.01); H01L 21/6719 (2013.01); H01L 21/67201 (2013.01); H01L 21/68771 (2013.01); H01L 21/67742 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A multi-chamber semiconductor manufacturing system, including:
a base, including a main body and a plurality of supporting frames protrudingly disposed on a mounting surface of the main body;
a plurality of processing units, connected to the plurality of supporting frames; and
a transfer unit, connected to the plurality of supporting frames and located between the plurality of processing units, configured to transfer a substrate between the plurality of processing units;
wherein as viewed in a height direction of the base, an outer contour of the base is rectangular, a length of the base is between 0.9 m and 1.2 m, and a width of the base is between 1.2 m and 1.5 m; the plurality of processing units and the transfer unit are integrated with the base, and a side of the main body opposite to the mounting surface has a plurality of casters disposed thereon.