US 12,288,659 B2
Power supply control device
Ryosuke Masuda, Yokkaichi (JP); Masayuki Kato, Yokkaichi (JP); Shunichi Sawano, Yokkaichi (JP); and Ryohei Sawada, Yokkaichi (JP)
Assigned to AutoNetworks Technologies, Ltd., Yokkaichi (JP); Sumitomo Wiring Systems, Ltd., Yokkaichi (JP); and Sumitomo Electric Industries, Ltd., Osaka (JP)
Appl. No. 18/260,953
Filed by AutoNetworks Technologies, Ltd., Yokkaichi (JP); Sumitomo Wiring Systems, Ltd., Yokkaichi (JP); and Sumitomo Electric Industries, Ltd., Osaka (JP)
PCT Filed Dec. 28, 2021, PCT No. PCT/JP2021/048786
§ 371(c)(1), (2) Date Jul. 11, 2023,
PCT Pub. No. WO2022/153872, PCT Pub. Date Jul. 21, 2022.
Claims priority of application No. 2021-003054 (JP), filed on Jan. 12, 2021.
Prior Publication US 2024/0071705 A1, Feb. 29, 2024
Int. Cl. H01H 85/02 (2006.01); H01H 85/143 (2006.01); B60R 16/03 (2006.01)
CPC H01H 85/0241 (2013.01) [H01H 85/143 (2013.01); B60R 16/03 (2013.01); H01H 2085/0275 (2013.01); H01H 2085/0283 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A vehicle power supply control device that controls power supply via a semiconductor switch by switching the semiconductor switch ON or OFF, comprising:
a fuse; and
a circuit board on which the semiconductor switch and the fuse are mounted, the circuit board including an insulating substrate, a pair of through holes passing through the insulating substrate and a plurality of substrate plating portions covering the insulating substrate, wherein the each of the pair of through holes has a first length,
wherein the fuse includes:
a pair of long plate-shaped terminals arranged in a row, the pair of long plate-shaped terminals includes a first plate portion and a second plate portion extending from the first plate portion, the first plate portion having a length longer than the first length of the pair of through holes and a width of the first plate portion is the same as a width of the second plate portion;
a fusing portion connected to two terminals of the plurality of terminals; and
a housing covering the fusing portion and a part of the terminals, and
the two terminals of the plurality of terminals are arranged in a current path of a current flowing through the semiconductor switch,
the current flows through the fusing portion,
the fusing portion is fused when a temperature of the fusing portion exceeds a predetermined temperature, and
the housing is heat-resistant; and
wherein a distal end of the first plate portion is pressed against a top surface of a top one of the plurality of substrate plating portions and the first plate portion of the pair of terminals respectively connected to the substrate plating portions by soldering and the second plate portion of the pair of terminals are disposed within the pair of through holes and connected within the pair of through holes by soldering.