US 12,288,640 B2
Coil electronic component
Tae Ryung Hu, Suwon-si (KR); Yu Jong Kim, Suwon-si (KR); Hye Yeon Jeon, Suwon-si (KR); Young Do Choi, Suwon-si (KR); Jong Min Lee, Suwon-si (KR); and Seung Hee Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 9, 2019, as Appl. No. 16/597,490.
Claims priority of application No. 10-2018-0145451 (KR), filed on Nov. 22, 2018.
Prior Publication US 2020/0168392 A1, May 28, 2020
Int. Cl. H01F 27/29 (2006.01); H01F 17/00 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01F 3/10 (2006.01); H01F 17/04 (2006.01)
CPC H01F 27/292 (2013.01) [H01F 17/0013 (2013.01); H01F 27/255 (2013.01); H01F 27/2804 (2013.01); H01F 41/046 (2013.01); H01F 2003/106 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/048 (2013.01); H01F 2027/2809 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A coil electronic component comprising:
a support substrate;
a coil portion disposed on at least one surface of the support substrate;
a body in which the support substrate and the coil portion are embedded; and
first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively,
wherein a thickness of the body is 0.55 mm or less,
wherein the body includes a cover portion disposed on the coil portion, and a ratio of a thickness of the coil portion to a thickness of the cover portion is more than 6:2 and less than or equal to 8:2, wherein the thickness of the cover portion is measured from an upper surface of the body to an upper surface of the coil portion, or measured from a lower surface of the body to a lower surface of the coil portion, and
wherein the thickness of the coil portion is larger than a width of the coil portion and is larger than a thickness of the support substrate.