US 12,288,632 B2
Copper foil structure and manufacturing method thereof
Te-Chao Liao, Taipei (TW); Wei-Sheng Cheng, Taipei (TW); and Chao-Tung Wu, Taipei (TW)
Assigned to NAN YA PLASTICS CORPORATION, Taipei (TW)
Filed by NAN YA PLASTICS CORPORATION, Taipei (TW)
Filed on Jan. 12, 2023, as Appl. No. 18/154,035.
Claims priority of application No. 111145238 (TW), filed on Nov. 25, 2022.
Prior Publication US 2024/0177884 A1, May 30, 2024
Int. Cl. H01B 5/00 (2006.01); H01B 1/02 (2006.01)
CPC H01B 5/002 (2013.01) [H01B 1/02 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A copper foil structure, comprising:
a copper foil layer; and
a conductive organic anti-oxidation layer disposed on the copper foil layer, wherein the conductive organic anti-oxidation layer comprises an organic antioxidant and a conductive polymer,
wherein based on the total weight of the conductive organic anti-oxidation layer, a content of the organic antioxidant ranges from 95 wt % to 99.9 wt %.