US 12,288,629 B2
Conductive particles and connection structure
Yuto Dobashi, Shiga (JP)
Assigned to SEKISUI CHEMICAL CO., LTD., Osaka (JP)
Appl. No. 17/630,602
Filed by SEKISUI CHEMICAL CO., LTD., Osaka (JP)
PCT Filed Jul. 30, 2020, PCT No. PCT/JP2020/029209
§ 371(c)(1), (2) Date Jan. 27, 2022,
PCT Pub. No. WO2021/020501, PCT Pub. Date Feb. 4, 2021.
Claims priority of application No. 2019-140015 (JP), filed on Jul. 30, 2019.
Prior Publication US 2022/0262537 A1, Aug. 18, 2022
Int. Cl. H01B 1/02 (2006.01); H05K 1/02 (2006.01); B82Y 30/00 (2011.01)
CPC H01B 1/02 (2013.01) [H05K 1/0265 (2013.01); B82Y 30/00 (2013.01); H05K 2201/0302 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A conductive particle comprising:
a base particle; and
a conductive portion disposed on a surface of the base particle,
a particle diameter of the conductive particle being 30 μm or more, and
a ratio of a resistance value (R20) of the conductive particle to a resistance value (R1) of the conductive particle being 1.5 or less,
wherein, provided that a process of applying a load at a smooth indenter end face of a cylinder at 25° C. until the conductive particle is 20% compressed and deformed in a center direction of the conductive particle and performing unloading is defined as 1 cycle, the resistance value (R20) of the conductive particle is measured after performing a compression test of 20 cycles in total, and the resistance value (R1) of the conductive particle is measured after performing a compression test of 1 cycles.