US 12,288,595 B2
System and method for providing compression attached memory module compression connectors
Arnold Thomas Schnell, Hutto, TX (US); and Joseph Daniel Mallory, Cedar Park, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by DELL PRODUCTS L.P., Round Rock, TX (US)
Filed on Jul. 17, 2024, as Appl. No. 18/775,312.
Application 18/775,312 is a continuation of application No. 17/855,291, filed on Jun. 30, 2022, granted, now 12,142,341.
Application 17/855,291 is a continuation in part of application No. 16/935,852, filed on Jul. 22, 2020, granted, now 11,394,141.
Prior Publication US 2024/0379133 A1, Nov. 14, 2024
Int. Cl. G11C 5/04 (2006.01); H01R 12/71 (2011.01); H01R 13/6471 (2011.01); H01R 43/20 (2006.01)
CPC G11C 5/04 (2013.01) [H01R 12/716 (2013.01); H01R 13/6471 (2013.01); H01R 43/205 (2013.01); H01R 2201/06 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A memory module comprising:
a first memory device;
a second memory device
a first circuit board, wherein the first and second memory devices are coupled to the first circuit board; and
compression contact elements coupled to the first circuit board,
wherein the compression contact elements include first contact elements which are configured to be coupled to a first memory channel for access to the first memory device, and second contact elements which are configured to be coupled to a second memory channel.