US 12,287,712 B2
Failover methods and systems in three-dimensional memory device
Joohee Kim, Sunnyvale, CA (US); and Dongyun Lee, Sunnyvale, CA (US)
Assigned to Rambus Inc., San Jose, CA (US)
Filed by Rambus Inc., San Jose, CA (US)
Filed on Nov. 29, 2022, as Appl. No. 18/059,900.
Claims priority of provisional application 63/303,623, filed on Jan. 27, 2022.
Claims priority of provisional application 63/286,799, filed on Dec. 7, 2021.
Prior Publication US 2023/0176953 A1, Jun. 8, 2023
Int. Cl. G11C 11/4093 (2006.01); G06F 11/20 (2006.01); G11C 29/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC G06F 11/2028 (2013.01) [G11C 29/816 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 25/0657 (2013.01); H01L 2224/32145 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/15311 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A memory device comprising:
a base memory die having:
a bottom base-die face including a bottom base-die primary data contact;
a top base-die face extending through the three-dimensional memory device and including a top base-die primary data contact and a top base-die secondary data contact;
a switchable connection between the bottom base-die primary data contact and the top base-die primary data contact;
base-die drive circuitry having a drive-circuitry input coupled to the top base-die secondary data contact and a drive-circuitry output coupled to the bottom base-die primary data contact; and
a base-die memory core coupled to the drive-circuitry input; and
an alternate memory die affixed atop the base memory die, the alternate memory die having:
a bottom alternate-die face extending through the three-dimensional memory device adjacent the top base-die face, the bottom alternate-die face including a bottom alternate-die primary data contact in contact with the top base-die primary data contact and a bottom alternate-die secondary data contact in contact with the top base-die secondary data contact; and
an alternate-die memory core coupled to the drive-circuitry input via the bottom alternate-die secondary data contact and the top base-die secondary data contact.