US 12,287,573 B2
Method of replicating a microstructure pattern
Riberet Almeida, Rochester, NY (US)
Assigned to VIAVI SOLUTIONS INC., Chandler, AZ (US)
Filed by VIAVI SOLUTIONS INC., San Jose, CA (US)
Filed on Jun. 3, 2021, as Appl. No. 17/338,144.
Prior Publication US 2022/0390839 A1, Dec. 8, 2022
Int. Cl. G03F 7/00 (2006.01); G03F 7/09 (2006.01)
CPC G03F 7/0035 (2013.01) [G03F 7/0002 (2013.01); G03F 7/094 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method, comprising:
providing a first multilayer structure including a substrate, a thin film, and a first photoresist layer;
providing a second multilayer structure including a mold having a microstructure pattern, and a second photoresist layer;
combining the first multilayer structure and the second multilayer structure so that the first photoresist layer is in contact with the second photoresist layer; and
applying pressure and temperature to form a photoresist stack, the photoresist stack having a replicated microstructure pattern, and a base portion that does not have the replicated microstructure pattern;
removing the mold;
after removing the mold, applying a flood exposure using a collimated light source to the photoresist stack, wherein collimated light exposes the replicated microstructure pattern and the base portion of the photoresist stack that does not have the replicated microstructure pattern; and
etching the photoresist stack and the thin film to form an etched microstructure pattern from the photoresist stack into the thin film.