US 12,287,510 B2
Integration of an unprocessed, direct-bandgap chip into a silicon photonic device
Stephen B. Krasulick, Albuquerque, NM (US); John Dallesasse, Geneva, IL (US); Amit Mizrahi, San Francisco, CA (US); Timothy Creazzo, Albuquerque, NM (US); Elton Marchena, Albuquerque, NM (US); and John Y. Spann, Albuquerque, NM (US)
Assigned to Skorpios Technologies, Inc., Albuquerque, NM (US)
Filed by Skorpios Technologies, Inc., Albuquerque, NM (US)
Filed on Nov. 5, 2021, as Appl. No. 17/520,467.
Application 17/520,467 is a continuation of application No. 15/073,957, filed on Mar. 18, 2016, granted, now 11,181,688.
Application 15/073,957 is a continuation in part of application No. 14/509,914, filed on Oct. 8, 2014, granted, now 9,316,785, issued on Apr. 19, 2016.
Application 15/073,957 is a continuation in part of application No. 14/488,041, filed on Sep. 16, 2014, abandoned.
Application 15/073,957 is a continuation in part of application No. 14/262,529, filed on Apr. 25, 2014, granted, now 9,324,682, issued on Apr. 26, 2016.
Application 15/073,957 is a continuation in part of application No. 13/605,633, filed on Sep. 6, 2012, granted, now 9,318,868, issued on Apr. 19, 2016.
Application 14/488,041 is a continuation of application No. 13/040,181, filed on Mar. 3, 2011, granted, now 8,867,578, issued on Oct. 21, 2014.
Application 13/040,181 is a continuation in part of application No. 12/903,025, filed on Oct. 12, 2010, granted, now 8,615,025, issued on Dec. 24, 2013.
Claims priority of provisional application 62/028,611, filed on Jul. 24, 2014.
Claims priority of provisional application 61/888,863, filed on Oct. 9, 2013.
Claims priority of provisional application 61/815,938, filed on Apr. 25, 2013.
Claims priority of provisional application 61/532,050, filed on Sep. 7, 2011.
Claims priority of provisional application 61/251,143, filed on Oct. 13, 2009.
Prior Publication US 2022/0171125 A1, Jun. 2, 2022
Int. Cl. G02B 6/12 (2006.01); H01S 5/02326 (2021.01); H01S 5/00 (2006.01); H01S 5/14 (2006.01)
CPC G02B 6/12004 (2013.01) [H01S 5/02326 (2021.01); G02B 2006/12176 (2013.01); H01L 2224/32225 (2013.01); H01S 5/005 (2013.01); H01S 5/14 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for fabricating a composite device for splitting functionality across two or more materials, the method comprising:
aligning a first mask with a target to define an etch area on a platform, wherein the platform comprises a first material, and wherein the target is outside the etch area;
etching a recess in the platform defined by the etch area;
bonding a chip in the recess of the platform, wherein:
the chip comprises a substrate, an etch stop layer, and an active region;
the etch stop layer is between the substrate and the active region;
the chip is made of a second material; and
the second material is different from the first material;
removing the substrate from the chip, after bonding the chip in the recess;
aligning a second mask with the target to define a feature area, wherein the feature area is over the chip; and
processing the feature area of the chip to form a feature on the chip after bonding the chip in the recess and removing the substrate from the chip.