US 12,287,464 B2
Multi-element wide-field lens for wafer-assembled chip-cube cameras
Kuang-Ju Wang, Taipei (TW); Jau-Jan Deng, Taipei (TW); and I-Lung Lu, New Taipei (TW)
Assigned to OmniVision Technologies, Inc., Santa Clara, CA (US)
Filed by OmniVision Technologies, Inc., Santa Clara, CA (US)
Filed on Dec. 21, 2022, as Appl. No. 18/086,522.
Prior Publication US 2024/0210663 A1, Jun. 27, 2024
Int. Cl. G02B 13/00 (2006.01); G02B 13/06 (2006.01); H01L 27/146 (2006.01); H04N 23/55 (2023.01); G02B 9/12 (2006.01); G03B 9/02 (2021.01)
CPC G02B 13/0085 (2013.01) [G02B 13/0035 (2013.01); G02B 13/06 (2013.01); H01L 27/14645 (2013.01); H01L 27/14687 (2013.01); H04N 23/55 (2023.01); G02B 9/12 (2013.01); G03B 9/02 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A chip-level camera comprises:
an image sensor integrated circuit having a photosensor array;
a concave L1 lens element formed on an inside surface of a first substrate;
a convex L2 lens element formed on a first surface of a second substrate;
a diaphragm stop formed on a second surface of the second substrate or on a first surface of a third substrate, the diaphragm stop between the second and third substrate;
a convex L3 lens element formed on a second surface of a third substrate spaced from the image sensor integrated circuit;
a first spacer configured to hold first substrate at a predetermined distance from second the substrate;
and a second spacer configured to hold the second substrate at a predetermined distance from the image sensor integrated circuit;
wherein lens element L1 has a concave aspheric radius of R1, and lens L2 a convex aspheric radius of R2, such that 1.3 is less than absolute value of R2 divided by R1, and absolute value of R2 divided by R1 is less than 2.2.