US 12,287,432 B2
Phased array LiDAR transmitting chip of mixed materials, manufacturing method thereof, and lidar device
Pengfei Wang, Beijing (CN); Yang Xu, Beijing (CN); Yejin Zhang, Beijing (CN); Hongyan Yu, Beijing (CN); Jiaoqing Pan, Beijing (CN); Qingfei Wang, Beijing (CN); and Linyan Tian, Beijing (CN)
Assigned to VANJEE TECHNOLOGY CO., LTD., Beijing (CN)
Filed by VANJEE TECHNOLOGY CO., LTD., Beijing (CN)
Filed on Sep. 30, 2020, as Appl. No. 17/039,722.
Application 17/039,722 is a continuation of application No. PCT/CN2019/112399, filed on Oct. 22, 2019.
Claims priority of application No. 201811423751.9 (CN), filed on Nov. 27, 2018.
Prior Publication US 2021/0018597 A1, Jan. 21, 2021
Int. Cl. G01S 7/484 (2006.01); G01S 7/4863 (2020.01); G01S 17/89 (2020.01); G02B 6/12 (2006.01); G02B 6/293 (2006.01); H01S 3/23 (2006.01); H04B 10/50 (2013.01)
CPC G01S 7/484 (2013.01) [G01S 7/4863 (2013.01); G01S 17/89 (2013.01); G02B 6/29382 (2013.01); H01S 3/2391 (2013.01); H04B 10/506 (2013.01); G02B 2006/12164 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A phased array light detection and ranging (LiDAR) transmitting chip of mixed materials, comprising: a first material structure layer and an SOI silicon waveguide structure layer, wherein an overlapping region of a rear end of the first material structure layer and a front end of the SOI silicon waveguide structure layer forms a coupling connection structure;
the first material structure layer is optically connected to the SOI silicon waveguide structure layer through the coupling connection structure;
the first material structure layer is configured to couple input light to the chip;
the coupling connection structure is configured to split a light wave coupled into the chip, and couple each of split light waves into a corresponding silicon waveguide in the SOI silicon waveguide structure layer; and
a non-linear refractive index of a first material in the first material structure layer is lower than a non-linear refractive index of a silicon material.