US 12,287,279 B2
Semiconductor laser inspection apparatus
Yohei Mikami, Tokyo (JP); and Tetsuhiro Fukao, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Jan. 5, 2023, as Appl. No. 18/150,657.
Application 18/150,657 is a division of application No. 18/004,228, previously published as PCT/JP2020/045110, filed on Dec. 3, 2020.
Prior Publication US 2023/0143906 A1, May 11, 2023
Int. Cl. G01N 21/01 (2006.01); H01L 21/67 (2006.01)
CPC G01N 21/01 (2013.01) [H01L 21/67248 (2013.01); G01N 2021/0106 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor laser inspection apparatus comprising:
a metal plate on which a semiconductor laser device is placed;
a heating-cooling device;
a probe holder attached on the heating-cooling device;
a measurement probe fixed to a distal end of the probe holder;
a fine movement table moving the heating-cooling device and the probe holder so that a distal end of the measurement probe contacts the semiconductor laser device;
an inspection apparatus inputting an inspection signal to the semiconductor laser device through the measurement probe; and
a spring having one end connected to an upper surface of the metal plate and the other end connected to a lower surface of the probe holder, wherein the spring thermally couples the metal plate and the probe holder without the measurement probe interposed therebetween.