US 12,287,156 B2
Partition plate, total heat exchange element and total heat exchanger including partition plate, and method for producing partition plate
Tasuku Izutani, Tokyo (JP); Shinya Tokizaki, Tokyo (JP); Takumi Oho, Tokyo (JP); Hajime Sotokawa, Tokyo (JP); and Xin Wang, Tokyo (JP)
Assigned to MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)
Appl. No. 18/030,294
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Oct. 23, 2020, PCT No. PCT/JP2020/039905
§ 371(c)(1), (2) Date Apr. 5, 2023,
PCT Pub. No. WO2022/085178, PCT Pub. Date Apr. 28, 2022.
Prior Publication US 2023/0375282 A1, Nov. 23, 2023
Int. Cl. F28F 3/00 (2006.01); F28D 21/00 (2006.01)
CPC F28D 21/0015 (2013.01) 17 Claims
OG exemplary drawing
 
1. A partition plate comprising:
a first layer including a first porous substrate having a plurality of first pores, the first layer having a first pinhole formed by at least some of the first pores;
a second layer stacked on the first layer and including a second porous substrate having a plurality of second pores, the second layer having a second pinhole formed by at least some of the second pores, the second pinhole being located at a position different from a position facing the first pinhole; and
a third layer stacked on the second layer and made of a water-insoluble moisture-permeable resin, wherein
the first pinhole and the second pinhole are each formed by interconnected pores each having a pore size larger than an average pore size of the first pores and the average pore size of the second pores.