US 12,287,147 B2
Wafer processing equipment and method of manufacturing semiconductor device
Sangjine Park, Suwon-si (KR); Youngtae Kim, Incheon (KR); Jihoon Jeong, Seongnam-si (KR); and Younghoo Kim, Yongin-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Oct. 4, 2021, as Appl. No. 17/493,346.
Claims priority of application No. 10-2021-0044297 (KR), filed on Apr. 5, 2021.
Prior Publication US 2022/0325953 A1, Oct. 13, 2022
Int. Cl. F26B 5/00 (2006.01); F26B 3/02 (2006.01); G03F 7/40 (2006.01); H01L 21/67 (2006.01)
CPC F26B 5/005 (2013.01) [F26B 3/02 (2013.01); G03F 7/40 (2013.01); H01L 21/67034 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A fluid supply device configured to supply a processing fluid to a wafer processing device that includes a chamber, the fluid supply device comprising:
a reservoir configured to change the processing fluid into a supercritical fluid state;
a wafer protecting device comprising a body configured to prevent a wafer in the chamber of the wafer processing device from being damaged by the processing fluid in the supercritical fluid state by receiving the processing fluid in the supercritical fluid state and limiting a speed of the processing fluid; and
a fluid supply line configured to provide a path for the processing fluid between the reservoir and the wafer protecting device and a path for the processing fluid between the wafer protecting device and the wafer processing device,
wherein a width of the body of the wafer protecting device, in a direction perpendicular to a flow direction of the processing fluid within the wafer protecting device, is greater than a diameter of the fluid supply line, and
wherein the wafer protecting device further comprises a mesh plate having a plurality of holes.