US 12,286,564 B2
Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same
Youngsam Kim, Daejeon (KR); You Jin Kyung, Daejeon (KR); Kwang Joo Lee, Daejeon (KR); Minsu Jeong, Daejeon (KR); Junghak Kim, Daejeon (KR); and Ju Hyeon Kim, Daejeon (KR)
Assigned to LG CHEM, LTD., Seoul (KR)
Appl. No. 17/266,864
Filed by LG CHEM, LTD., Seoul (KR)
PCT Filed May 8, 2020, PCT No. PCT/KR2020/006100
§ 371(c)(1), (2) Date Feb. 8, 2021,
PCT Pub. No. WO2020/231101, PCT Pub. Date Nov. 19, 2020.
Claims priority of application No. 10-2019-0055222 (KR), filed on May 10, 2019; and application No. 10-2020-0054681 (KR), filed on May 7, 2020.
Prior Publication US 2021/0292618 A1, Sep. 23, 2021
Int. Cl. C09J 163/04 (2006.01); C09J 7/10 (2018.01); C09J 11/04 (2006.01); C09J 11/08 (2006.01); H01L 23/00 (2006.01)
CPC C09J 163/04 (2013.01) [C09J 7/10 (2018.01); C09J 11/04 (2013.01); C09J 11/08 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/83203 (2013.01)] 12 Claims
 
1. A resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst,

OG Complex Work Unit Chemistry

OG Complex Work Unit Chemistry
wherein the curing catalyst includes at least one compound selected from the compounds represented by Chemical Formulae 1-1 to 1-5:

OG Complex Work Unit Chemistry