US 12,285,840 B2
Polishing head, polishing apparatus, and method of manufacturing semiconductor wafer
Yuki Nakano, Saga (JP); Ryoya Terakawa, Saga (JP); Takayuki Kihara, Saga (JP); and Hiroki Ota, Saga (JP)
Assigned to SUMCO CORPORATION, Tokyo (JP)
Appl. No. 17/600,189
Filed by SUMCO CORPORATION, Tokyo (JP)
PCT Filed Dec. 27, 2019, PCT No. PCT/JP2019/051501
§ 371(c)(1), (2) Date Sep. 30, 2021,
PCT Pub. No. WO2020/202682, PCT Pub. Date Oct. 8, 2020.
Claims priority of application No. 2019-072485 (JP), filed on Apr. 5, 2019.
Prior Publication US 2022/0161388 A1, May 26, 2022
Int. Cl. H01L 21/304 (2006.01); B24B 37/10 (2012.01); B24B 37/32 (2012.01); H01L 21/306 (2006.01)
CPC B24B 37/32 (2013.01) [B24B 37/102 (2013.01); H01L 21/30625 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A polishing head comprising:
a first ring-shaped member having an opening;
a plate-shaped member that closes the opening on an upper side of the first ring-shaped member;
a membrane that closes the opening on a lower side of the first ring-shaped member;
a back pad adhered to a lower surface of the membrane, such that no space is formed between the back pad and the membrane; and
a second ring-shaped member located below the back pad and having an opening that holds a polishing target workpiece, wherein
a space, formed by closing the opening of the first ring-shaped member by the plate-shaped member and the membrane, comprises:
a central region; and
an outer peripheral region partitioned from the central region by a partition,
an inner peripheral edge region of the second ring-shaped member is located vertically below an outer peripheral edge of the outer peripheral region, and
the partition is connected to the plate-shaped member.