US 12,285,839 B2
Carrier head for chemical mechanical polishing apparatus comprising substrate receiving member
Joon Mo Kang, Seongnam (KR)
Appl. No. 16/080,002
Filed by Joon Mo Kang, Seongnam (KR)
PCT Filed Mar. 9, 2017, PCT No. PCT/KR2017/002606
§ 371(c)(1), (2) Date Aug. 25, 2018,
PCT Pub. No. WO2017/171262, PCT Pub. Date Oct. 5, 2017.
Claims priority of application No. 10-2016-0039976 (KR), filed on Apr. 1, 2016.
Prior Publication US 2019/0061098 A1, Feb. 28, 2019
Int. Cl. B24B 37/27 (2012.01); B24B 37/00 (2012.01); B24B 37/30 (2012.01); B24B 41/00 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01); H01L 21/463 (2006.01); H01L 21/465 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01)
CPC B24B 37/27 (2013.01) [B24B 37/00 (2013.01); B24B 37/30 (2013.01); B24B 41/002 (2013.01); H01L 21/3043 (2013.01); H01L 21/306 (2013.01); H01L 21/463 (2013.01); H01L 21/465 (2013.01); H01L 21/67 (2013.01); H01L 21/673 (2013.01); H01L 21/67309 (2013.01); H01L 21/67126 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A carrier head for a chemical mechanical polishing apparatus, comprising:
a base;
a substrate receiving member comprising a plate portion having an outer surface for receiving a substrate and an inner surface at the back of the outer surface, a perimeter portion extended in a height direction from an edge of the plate portion, a securing portion continuously extended from an outer part of the perimeter portion and connected to a lower part of the base, and a contact portion continuously extended from an inner part of the perimeter portion;
a contact coupling structure connected to the lower part of the base to provide a contact surface to the contact portion; and
a perimeter portion pressurizing chamber formed by taking the securing portion and the contact portion as chamber walls when the contact portion contacts firmly the contact coupling structure by means of fluid pressure,
wherein fluid in the perimeter portion pressurizing chamber is prevented from flowing to an inner side surface of the perimeter portion when fluid pressure in the perimeter portion pressurizing chamber is higher than fluid pressure acting on the inner side surface of the perimeter portion, but fluid acting on the inner side surface of the perimeter portion is allowed to flow into the perimeter portion pressurizing chamber when fluid pressure acting on the inner side surface of the perimeter portion is higher than fluid pressure in the perimeter portion pressurizing chamber.