US 12,285,838 B2
Wafer edge asymmetry correction using groove in polishing pad
Jimin Zhang, San Jose, CA (US); Jianshe Tang, San Jose, CA (US); Brian J. Brown, Palo Alto, CA (US); Wei Lu, Fremont, CA (US); and Priscilla Diep LaRosa, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Nov. 9, 2023, as Appl. No. 18/505,871.
Application 18/505,871 is a continuation of application No. 16/953,139, filed on Nov. 19, 2020, granted, now 11,951,589.
Claims priority of provisional application 62/939,538, filed on Nov. 22, 2019.
Prior Publication US 2024/0075583 A1, Mar. 7, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. B24B 37/26 (2012.01); B24B 37/005 (2012.01); B24B 37/04 (2012.01); B24B 37/27 (2012.01)
CPC B24B 37/26 (2013.01) [B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 37/27 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A chemical mechanical polishing system comprising:
a rotatable platen to hold a polishing pad, the platen rotatable by a motor, the polishing pad having a polishing surface and a polishing control groove concentric with an axis of rotation for the polishing pad;
a rotatable carrier head to hold a substrate against the polishing surface of the polishing pad during a polishing process, the carrier head laterally movable by a first actuator across the polishing pad and rotatable by a second actuator; and
a controller configured to control the first actuator and the second actuator to synchronize lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove so as to improve angular polishing uniformity along the edge portion of the substrate.