US 12,285,821 B2
Method for the laser machining of a workpiece
Feng Feng, Taicang (CN); Franz Lehleuter, Shanghai (CN); Yuan Liu, Taicang (CN); Ke You Chen, Taicang (CN); and Yi Fei, Taicang (CN)
Assigned to TRUMPF (CHINA) CO., LTD., Taicang (CN)
Filed by TRUMPF (China) Co., Ltd., Taicang (CN)
Filed on Nov. 25, 2024, as Appl. No. 18/957,944.
Application 18/957,944 is a continuation of application No. PCT/CN2022/095208, filed on May 26, 2022.
Prior Publication US 2025/0083260 A1, Mar. 13, 2025
Int. Cl. B23K 26/53 (2014.01); B23K 26/08 (2014.01)
CPC B23K 26/53 (2015.10) [B23K 26/0869 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for the laser machining of a workpiece by means of a machining beam, the workpiece having a material that is transparent to a wavelength λ of the machining beam, in which method material modifications are formed in the material along a predetermined machining line by action of the machining beam upon the material, a first group of spaced-apart material modifications is formed in the material, with mutually adjacent material modifications of the first group being formed one after the other in time and having a distance d0 from one another of at least 0.25*λ and/or at most 2.5*λ, and in which method a second group of spaced-apart material modifications is formed in the material, with mutually adjacent material modifications of the second group being formed one after the other in time and having a distance do from one another of at least 0.25*λ and/or at most 2.5*λ, and the shortest distance d1 between the material modifications of the first group and the material modifications of the second group being at least 5 μm.