US 12,285,767 B2
Solder particle classifying method, solder particle, solder particle classifying system, adhesive composition, and adhesive film
Shohei Yamazaki, Tokyo (JP); Hiroyuki Izawa, Tokyo (JP); and Toshiyuki Sugimoto, Yamagata (JP)
Assigned to Resonac Corporation, Tokyo (JP); and Toshiyuki Sugimoto, Yamagata (JP)
Appl. No. 18/559,618
Filed by Resonac Corporation, Tokyo (JP); and Toshiyuki Sugimoto, Yamagata (JP)
PCT Filed May 2, 2022, PCT No. PCT/JP2022/019535
§ 371(c)(1), (2) Date Nov. 8, 2023,
PCT Pub. No. WO2022/239701, PCT Pub. Date Nov. 17, 2022.
Claims priority of application No. PCT/JP2021/017922 (WO), filed on May 11, 2021.
Prior Publication US 2024/0238804 A1, Jul. 18, 2024
Int. Cl. B03C 7/02 (2006.01); B07B 13/04 (2006.01)
CPC B03C 7/02 (2013.01) [B07B 13/04 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for classifying solder particles, the method comprising:
a first step of forming an electric field between a first electrode and a second electrode included in an electrostatic attraction device, the first electrode having a disposition part having electrostatic diffusivity or electrical conductivity, the second electrode having an attraction part having electrical insulation properties, which faces the disposition part and is provided with a plurality of opening parts opened to the disposition part side, so as to cause solder particles P disposed on the disposition part to be electrostatically attracted to the attraction part;
a second step of removing solder particles P2 that are attracted to the attraction part and are not accommodated in the opening parts, from the attraction part; and
a third step of collecting solder particles P1 accommodated in the opening parts, from the attraction part that has been subjected to the second step,
wherein the solder particles P have an average particle size of 10 μm or more.