US 12,285,260 B2
Catheter-deployable soft robotic sensor arrays and processing of flexible circuits
Simon Dunham, New York, NY (US); Bobak Mosadegh, New York, NY (US); Varun Umesh Kashyap, New York, NY (US); Tejas Doshi, New York, NY (US); and Alexandre Caprio, New York, NY (US)
Assigned to Cornell University, Ithaca, NY (US)
Appl. No. 17/920,638
Filed by Cornell University, Ithaca, NY (US)
PCT Filed Apr. 23, 2021, PCT No. PCT/US2021/028940
§ 371(c)(1), (2) Date Oct. 21, 2022,
PCT Pub. No. WO2021/217066, PCT Pub. Date Oct. 28, 2021.
Claims priority of provisional application 63/015,344, filed on Apr. 24, 2020.
Prior Publication US 2023/0146045 A1, May 11, 2023
Int. Cl. H05K 3/00 (2006.01); A61B 5/00 (2006.01); A61B 5/28 (2021.01); A61B 5/283 (2021.01); A61B 5/287 (2021.01); A61B 5/367 (2021.01); H05K 1/02 (2006.01)
CPC A61B 5/287 (2021.01) [A61B 5/283 (2021.01); A61B 5/367 (2021.01); A61B 5/6853 (2013.01); A61B 5/6858 (2013.01); H05K 3/0032 (2013.01); H05K 3/0064 (2013.01); A61B 2562/166 (2013.01); H05K 1/0277 (2013.01); H05K 2201/09263 (2013.01); H05K 2203/107 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
identifying one or more regions of a printed circuit board (PCB) for selectively removing insulation material, the PCB including one or more electrically conductive structures arranged on an insulation layer; and
applying, within each region of the one or more regions, thermal energy via a heat source to a surface of the PCB within the region such that insulation material of the insulation layer is removed from the region while the one or more electrically conductive structures and a portion of the insulation layer beneath the one or more electrically conductive structures are maintained.