| CPC H10N 70/826 (2023.02) [H10B 63/00 (2023.02); H10N 70/021 (2023.02); H10N 70/8833 (2023.02)] | 20 Claims |
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1. An interposer comprising:
a substrate;
a dielectric layer disposed on the substrate;
a via disposed entirely within the dielectric layer;
a resistive film layer disposed to line the via;
a metal interconnect disposed in the resistive layer lined via; and
a plurality of metal lines disposed in the dielectric layer, the plurality of metal lines including a first metal line connected to the metal interconnect, a second metal line connected to the resistive film layer at a first point, and a third metal line connected to the resistive film layer at a second point.
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