| CPC H10K 59/1213 (2023.02) [H10K 59/1216 (2023.02); H10K 59/131 (2023.02)] | 20 Claims |

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1. An array substrate, comprising:
a substrate;
a polysilicon active layer disposed at a side of the substrate;
a first metal layer disposed at a side of the polysilicon active layer away from the substrate;
an oxide active layer disposed at a side of the first metal layer away from the substrate;
a third metal layer disposed at a side of the oxide active layer away from the substrate; and
a source/drain layer disposed at a side of the third metal layer away from the substrate;
wherein the first metal layer is patterned to form a first gate electrode of a low temperature polysilicon thin film transistor, the source/drain layer is patterned to form a first source electrode and a first drain electrode of the low temperature polysilicon thin film transistor, and the first source electrode and the first drain electrode are connected to the polysilicon active layer;
wherein the third metal layer is patterned to form a second gate electrode of a low temperature polycrystalline oxide thin film transistor, and the source/drain layer is further patterned to form a second source electrode and a second drain electrode of the low temperature polycrystalline oxide thin film transistor, and the second source electrode and the second drain electrode are connected to the oxide active layer;
wherein the second source electrode is directly connected to the polysilicon active layer through a through hole;
wherein the array substrate further comprises a first interlayer dielectric layer disposed between the first metal layer and the oxide active layer; and
wherein the through hole has a stair at the first interlayer dielectric layer and has a taper angle of 40° to 80°, and an edge of the stair is smooth.
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