US 12,284,853 B2
LED package structure
Chien-Hsin Tu, Hsinchu (TW)
Assigned to Lextar Electronics Corporation, Hsinchu (TW)
Filed by Lextar Electronics Corporation, Hsinchu (TW)
Filed on Dec. 21, 2023, as Appl. No. 18/393,602.
Application 18/393,602 is a continuation of application No. 17/386,561, filed on Jul. 28, 2021, granted, now 11,888,099.
Claims priority of application No. 202011201328.1 (CN), filed on Nov. 2, 2020.
Prior Publication US 2024/0136483 A1, Apr. 25, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 33/58 (2010.01); H10H 20/85 (2025.01); H10H 20/851 (2025.01); H10H 20/855 (2025.01)
CPC H10H 20/855 (2025.01) [H10H 20/8506 (2025.01); H10H 20/851 (2025.01)] 14 Claims
OG exemplary drawing
 
1. A light emitting diode (LED) package structure comprising:
an electrically-insulated frame having a surface, wherein the surface has four corners;
a trough recessed in the surface;
an LED chip disposed in the trough;
a fluorescent colloid filled within the trough and covering the LED chip; and
at least two spacing members protruding from two of the four corners on the surface, wherein one of the four corners is a location-recognized corner, and the at least two spacing members are located at remaining corners of the four corners except the location-recognized corner.