US 12,284,792 B2
Power electronics assemblies having power electronics devices embedded within a flip chip
Feng Zhou, Ann Arbor, MI (US)
Assigned to TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., Plano, TX (US)
Filed by Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US)
Filed on Feb. 23, 2023, as Appl. No. 18/173,231.
Prior Publication US 2024/0292576 A1, Aug. 29, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 7/20927 (2013.01) [H05K 1/0206 (2013.01); H05K 1/183 (2013.01); H05K 7/20254 (2013.01); H05K 2201/064 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A power electronics assembly comprising:
a circuit board assembly comprising:
a plurality of electrically conductive logic layers;
a plurality of electrically conductive power layers; and
a laminate panel provided between the plurality of electrically conductive logic layers and the plurality of electrically conductive power layers, the laminate panel comprising:
a power electronics device assembly comprising:
a substrate comprising:
 a graphite layer; and
 a metal layer encasing the graphite layer, a recess formed in an outer surface of the metal layer; and
a power electronics device bonded within the recess of the outer surface of the substrate,
wherein each electrically conductive logic layer is provided at a first surface of the laminate panel, and each electrically conductive power layer is provided at a second surface of the laminate panel opposite the first surface of the laminate panel.