US 12,284,785 B2
Assembly and method for cooling an apparatus
Michael Andrew Palmer, Stevenage (GB)
Assigned to MBDA UK LIMITED, Stevenage (GB)
Appl. No. 17/800,246
Filed by MBDA UK LIMITED, Stevenage (GB)
PCT Filed Feb. 9, 2021, PCT No. PCT/GB2021/050283
§ 371(c)(1), (2) Date Aug. 17, 2022,
PCT Pub. No. WO2021/165644, PCT Pub. Date Aug. 26, 2021.
Claims priority of application No. 20275044 (EP), filed on Feb. 18, 2020; and application No. 2002176 (GB), filed on Feb. 18, 2020.
Prior Publication US 2023/0068459 A1, Mar. 2, 2023
Int. Cl. H05K 7/20 (2006.01); F41G 7/22 (2006.01); G01S 7/02 (2006.01)
CPC H05K 7/20309 (2013.01) [H05K 7/20327 (2013.01); F41G 7/2286 (2013.01); G01S 7/028 (2021.05)] 14 Claims
OG exemplary drawing
 
1. An evaporative cooling assembly for cooling an electronic apparatus, the evaporative cooling assembly comprising:
a refrigerant tank, the refrigerant tank containing refrigerant;
a first evaporator positioned to cool the electronic apparatus; and
a second evaporator;
wherein the first evaporator is in fluid communication with the refrigerant tank; and the second evaporator is in fluid communication with the first evaporator, is positioned downstream of the first evaporator, and is positioned to cool the refrigerant tank.