US 12,284,783 B2
Device with integrated liquid cooling system
Oren Weltsch, Harish (IL); Rom Becker, Ramat Yishai (IL); Shay Zaretsky, Kiryat Motzkin (IL); Ayal Shabtay, Haifa (IL); Beeri Halachmi, Kfar Sava (IL); Yuval Blayer, Avtalyon (IL); Kfir Katz, Kiryat Tivon (IL); Yuval Dagan, Gilon (IL); and Bar Noyman, Kibbutz Kfar Hachoresh (IL)
Assigned to Mellanox Technologies Ltd., Yokneam (IL)
Filed by Mellanox Technologies Ltd., Yokneam (IL)
Filed on Nov. 24, 2021, as Appl. No. 17/534,645.
Prior Publication US 2023/0164948 A1, May 25, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20272 (2013.01) [G06F 1/20 (2013.01); H05K 7/20263 (2013.01); G06F 2200/201 (2013.01); H05K 7/20781 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A device comprising:
a frame having an interior;
an electronic component;
a heat conducting body in thermal contact with the electronic component;
a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body;
a heat sink positioned within the interior of the frame, wherein at least a portion of the conduit passes through the heat sink, and wherein the heat sink comprises a plurality of fins that are parallel to an axis extending between a first end and a second end of the frame; and
a first pump and a second pump positioned within the interior of the frame, the first pump and the second pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit;
wherein the first pump and the second pump are positioned one above the other relative to a bottom surface of the frame and along a side wall of the frame.