US 12,284,782 B2
Cooling electronic devices installed in a subsurface environment
David Lane Smith, Bryan, TX (US)
Filed by David Lane Smith, Bryan, TX (US)
Filed on Aug. 22, 2022, as Appl. No. 17/893,042.
Application 17/893,042 is a continuation in part of application No. 16/362,681, filed on Mar. 24, 2019, granted, now 11,421,921, issued on Aug. 23, 2022.
Application 16/362,681 is a continuation in part of application No. 15/457,025, filed on Mar. 13, 2017, granted, now 10,240,845, issued on Mar. 26, 2019.
Application 15/457,025 is a continuation in part of application No. 14/378,261, granted, now 9,593,876, issued on Mar. 14, 2017, previously published as PCT/US2013/054414, filed on Aug. 9, 2013.
Claims priority of provisional application 61/698,365, filed on Sep. 7, 2012.
Prior Publication US 2022/0400577 A1, Dec. 15, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01); F24T 10/10 (2018.01)
CPC H05K 7/20236 (2013.01) [H05K 7/20263 (2013.01); H05K 7/20272 (2013.01); F24T 10/10 (2018.05)] 22 Claims
OG exemplary drawing
 
1. A system to cool electronic devices installed in a subsurface environment, the system comprising:
a containment vessel comprising:
a first thermally conductive fluid;
a second thermally conductive fluid at least partially filling an interior space of said containment vessel;
one or more electronic devices disposed within the interior space of said containment vessel, a number of the one or more electronic devices being in direct, indirect, or direct and indirect thermal contact with said second thermally conductive fluid to perform heat exchange between the number of the one or more electronic devices and to yield a heated said second thermally conductive fluid;
a piping assembly configured to flow heated said first thermally conductive fluid from a second heat exchanger located internal to said containment vessel to a first heat exchanger located external to said containment vessel;
said piping assembly configured to flow cooled said first thermally conductive fluid from said first heat exchanger to said second heat exchanger; and
cabling which is extended from the interior space of said containment vessel to a location external to said containment vessel; and
a heat exchanger circuit comprising:
said first heat exchanger located external to said containment vessel, wherein said first heat exchanger is configured to receive heated said first thermally conductive fluid from said second heat exchanger, wherein said first heat exchanger is configured to perform a cooling operation on said first thermally conductive fluid, and wherein said first heat exchanger is in at least one location selected from the group of within subsurface environment and above subsurface environment;
said second heat exchanger located internal to said containment vessel, wherein said second heat exchanger is configured to receive cooled said first thermally conductive fluid from said first heat exchanger and wherein said second heat exchanger is configured to perform a cooling operation on said second thermally conductive fluid;
said piping assembly configured to flow heated said first thermally conductive fluid and wherein said piping assembly is configured to guide the flow of heated said first thermally conductive fluid from said second heat exchanger to said first heat exchanger; and
said piping assembly configured to flow cooled said first thermally conductive fluid and wherein said piping assembly is configured to guide the flow of cooled said first thermally conductive fluid from said first heat exchanger to said second heat exchanger.