US 12,284,781 B2
Sound absorption device, heat dissipation device and server chassis
Haiyan Chen, Beijing (CN); and Yewei Cao, Beijing (CN)
Assigned to LENOVO (BEIJING) LIMITED, Beijing (CN)
Filed by Lenovo (Beijing) Limited, Beijing (CN)
Filed on Mar. 1, 2022, as Appl. No. 17/684,128.
Claims priority of application No. 202110831593.6 (CN), filed on Jul. 22, 2021.
Prior Publication US 2023/0021389 A1, Jan. 26, 2023
Int. Cl. H05K 7/20 (2006.01); F04D 29/66 (2006.01)
CPC H05K 7/20154 (2013.01) [F04D 29/664 (2013.01); H05K 7/20145 (2013.01); H05K 7/20172 (2013.01); H05K 7/20736 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A sound absorbing device to be placed in an airflow in a first direction, comprising:
a housing;
a plurality of sound absorbing units disposed in the housing to be passed by the airflow, the plurality of sound absorbing units being arranged in a direction perpendicular to the first direction, any two adjacent sound absorbing units being separated by a gap; and
a plurality of supports fixed in the housing, wherein the plurality of sound absorbing units are fixed to the housing through the plurality of supports;
wherein each of the plurality of supports includes two or more first support pieces and two or more second support pieces, and a first one of the two or more second support pieces facing the first direction has an arc shape, a second one of the two or more second support pieces forms a flat surface perpendicular to the first direction, and the two or more first support pieces each forms an acute angle with the flat surface formed by the second one of the two or more second support pieces.