US 12,284,771 B2
Closed-cavity printed circuit board
Ki Wook Lee, Irvine, CA (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Feb. 27, 2023, as Appl. No. 18/114,523.
Application 17/230,367 is a division of application No. 15/967,955, filed on May 1, 2018, granted, now 10,986,739, issued on Apr. 20, 2021.
Application 18/114,523 is a continuation of application No. 17/230,367, filed on Apr. 14, 2021, granted, now 11,622,453.
Claims priority of provisional application 62/502,499, filed on May 5, 2017.
Prior Publication US 2023/0328901 A1, Oct. 12, 2023
Int. Cl. H05K 3/46 (2006.01); H01Q 1/38 (2006.01); H05K 1/16 (2006.01); H01Q 9/04 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01)
CPC H05K 3/4697 (2013.01) [H01Q 1/38 (2013.01); H05K 1/165 (2013.01); H05K 3/4623 (2013.01); H05K 3/4655 (2013.01); H01Q 9/0407 (2013.01); H05K 3/0026 (2013.01); H05K 3/0047 (2013.01); H05K 3/005 (2013.01); H05K 3/06 (2013.01); H05K 3/4038 (2013.01); H05K 3/429 (2013.01); H05K 2201/10098 (2013.01); Y10T 29/49016 (2015.01); Y10T 29/5317 (2015.01)] 20 Claims
OG exemplary drawing
 
1. A closed-cavity printed circuit board comprising:
a core layer with a cavity that extends entirely through the core layer from a top surface of the core layer to a bottom surface of the core layer with a first portion of the core layer forming a first side of the cavity and a second portion of the core layer forming a second side of the cavity;
a first adhesive layer and a first patterned metal layer disposed over the top surface of the core layer to form a top of the cavity, and a second adhesive layer and a second patterned metal layer disposed over the bottom surface of the core layer to form a bottom of the cavity, the cavity being a closed cavity antenna filled with air; and
vias through the first adhesive layer, the core layer, and the second adhesive layer to electrically connect portions of the first patterned metal layer with portions of the second patterned metal layer.