| CPC H05K 3/3436 (2013.01) [B23K 1/0008 (2013.01); H05K 1/181 (2013.01); H05K 3/28 (2013.01); H05K 3/3452 (2013.01); B23K 2101/42 (2018.08); H05K 2201/10636 (2013.01)] | 11 Claims |
|
1. A conformal coating control method, comprising:
arranging a solder mask material on a surface of a printed circuit board in channels between contact portions of the printed circuit board that are configured to connect to corresponding perimeter pads of an integrated circuit,
wherein the solder mask material fills the channels and reduces a height of a stand-off gap in the channels between the integrated circuit and the printed circuit board, relative to a stand-off gap in the channels between the integrated circuit and the printed circuit board without the solder mask material, to a second height, and
wherein the contact portions are located along a perimeter of the integrated circuit;
soldering the integrated circuit to the printed circuit board using the contact portions of the printed circuit board and the corresponding perimeter pads of the integrated circuit;
accumulating solder flux residue from the soldering on the solder mask material; and
applying a conformal coating material to the integrated circuit and the printed circuit board,
wherein the conformal coating material is partially restricted from flowing between the integrated circuit and the printed circuit board through the channels between the contact portions by the solder mask material and the accumulated solder flux residue, and
wherein the flowing is permitted to only in a portion of the channels.
|