US 12,284,767 B2
Method for manufacturing wiring board, wiring board, method for manufacturing molded object, molded object
Kazutoshi Koshimizu, Chiba (JP)
Assigned to Fujikura Ltd., Tokyo (JP)
Appl. No. 17/779,898
Filed by Fujikura Ltd., Tokyo (JP)
PCT Filed Nov. 18, 2020, PCT No. PCT/JP2020/042995
§ 371(c)(1), (2) Date May 25, 2022,
PCT Pub. No. WO2021/106713, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 2019-212302 (JP), filed on Nov. 25, 2019.
Prior Publication US 2023/0007781 A1, Jan. 5, 2023
Int. Cl. H05K 3/04 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01); H05K 3/12 (2006.01)
CPC H05K 3/048 (2013.01) [H05K 1/0353 (2013.01); H05K 3/101 (2013.01); H05K 3/1258 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/0574 (2013.01); H05K 2203/0582 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for manufacturing a wiring board, comprising:
disposing a first resist material on a substrate;
forming a first resist layer by curing the first resist material;
forming a resin layer on a release film;
forming a conductor portion on the resin layer;
covering the conductor portion by disposing a second resist material on the resin layer;
forming a second resist layer by curing the second resist material;
bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and
releasing the release film from the resin layer, wherein
the conductor portion comprises:
a first conductor portion; and
a second conductor portion,
the wiring board comprises an insulation layer interposed between the first and second conductor portions, and
the forming of the conductor portion on the resin layer comprises:
forming the second conductor portion on the resin layer;
forming the insulation layer on at least a part of the second conductor portion; and
forming the first conductor portion on both of the resin layer and the insulation layer.