	US 12,284,766 B2
	Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate
Wei Zhou, Shenzhen (CN); Qiang Xu, Shenzhen (CN); and Caicai Xie, Shenzhen (CN)
Assigned to BYD COMPANY LIMITED, Shenzhen (CN)
Appl. No. 18/003,866
Filed by BYD COMPANY LIMITED, Guangdong (CN)
PCT Filed Jun. 28, 2021, PCT No. PCT/CN2021/102841 § 371(c)(1), (2) Date Dec. 29, 2022, PCT Pub. No. WO2022/001983, PCT Pub. Date Jan. 6, 2022.
Claims priority of application No. 202010605357.8 (CN), filed on Jun. 29, 2020.
Prior Publication US 2023/0269879 A1, Aug. 24, 2023
Int. Cl. H05K 3/02 (2006.01); C04B 37/02 (2006.01); C23C 22/52 (2006.01); H05K 1/03 (2006.01); H05K 3/38 (2006.01)

CPC H05K 3/022 (2013.01) [C04B 37/023 (2013.01); H05K 1/0306 (2013.01); H05K 3/385 (2013.01); C04B 2237/122 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); C04B 2237/525 (2013.01); C23C 22/52 (2013.01); H05K 2203/0786 (2013.01); H05K 2203/1105 (2013.01)]

18 Claims

1. A method for preparing a ceramic copper clad laminate, comprising following steps:

forming a copper oxide layer on a surface of a copper material;

thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms into the copper material;

removing the copper oxide layer on the thermally treated copper material by pickling or grinding, and

soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain the ceramic copper clad laminate.