US 12,284,763 B2
Printed circuit board and method for manufacturing the same
Yuta Tamaki, Tokyo (JP); and Kazutaka Eto, Tokyo (JP)
Assigned to Sony Interactive Entertainment Inc., Tokyo (JP)
Appl. No. 17/594,855
Filed by Sony Interactive Entertainment Inc., Tokyo (JP)
PCT Filed May 21, 2020, PCT No. PCT/JP2020/020162
§ 371(c)(1), (2) Date Nov. 1, 2021,
PCT Pub. No. WO2020/235645, PCT Pub. Date Nov. 26, 2020.
Claims priority of application No. 2019-096801 (JP), filed on May 23, 2019.
Prior Publication US 2022/0312658 A1, Sep. 29, 2022
Int. Cl. H05K 13/00 (2006.01); H05K 13/04 (2006.01); H05K 13/08 (2006.01)
CPC H05K 13/046 (2013.01) [H05K 13/0813 (2018.08)] 3 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
through-holes into which one or more electrical leads of a plurality of types of respective components are to be attached by inserting such one or more electrical leads, which extend from respective bodies of such respective components, through the through holes; and
a respective electrically conductive region located around each of the through-holes to electrically connect the one or more electrical leads of the respective components to the printed circuit board,
wherein a respective shape of the electrically conductive region corresponds to an appearance of a given one of the respective bodies, not the one or more electrical leads, of a given one of the respective components.