US 12,284,749 B2
Power module with housed power semiconductors for controllable electrical power supply of a consumer, and method for producing same
Thomas Maier, Neunburg v. Wald (DE)
Assigned to ZF Friedrichshafen AG, Friedrichshafen (DE)
Appl. No. 17/778,936
Filed by ZF Friedrichshafen AG, Friedrichshafen (DE)
PCT Filed Nov. 23, 2020, PCT No. PCT/EP2020/083000
§ 371(c)(1), (2) Date May 23, 2022,
PCT Pub. No. WO2021/105028, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 10 2019 218 157.0 (DE), filed on Nov. 25, 2019; and application No. 20 2019 106 541.9 (DE), filed on Nov. 25, 2019.
Prior Publication US 2022/0418088 A1, Dec. 29, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/0209 (2013.01) [H05K 1/0256 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 3/303 (2013.01); H05K 3/3415 (2013.01); H05K 2201/066 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10977 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A power module for controllable electrical power supply of a consumer, wherein the power module has:
a plurality of housed power semiconductors each comprising an electrically non-insulated heat dissipation surface;
a printed circuit board;
a heat sink; and
at least one insulation plate,
wherein the printed circuit board is arranged on a side of the power semiconductors which is opposite to the heat sink in an orthogonal direction,
wherein the at least one insulation plate is arranged between the housed power semiconductors and a cooling surface of the heat sink,
wherein the at least one insulation plate is connected with one side to an electrically non-insulated heat dissipation surface of at least one housed power semiconductor of the plurality of housed power semiconductors in a form-fitting manner and is connected with another side to the heat sink in a form-fitting manner, and
wherein the at least one insulation plate has an electrically conductive metallization on a side facing the at least one housed power semiconductor and on a side facing the cooling surface of the heat sink.