US 12,284,748 B2
Target assembly comprising a fission product capturing layer on a fissile target substrate
Samuel S. Morrison, Richland, WA (US); Lance R. Hubbard, Richland, WA (US); Nicolas Uhnak, Kennewick, WA (US); Bruce K. McNamara, Kennewick, WA (US); and Gabriel B. Hall, Richland, WA (US)
Assigned to Battelle Memorial Institute, Richland, WA (US)
Filed by BATTELLE MEMORIAL INSTITUTE, Richland, WA (US)
Filed on Jul. 31, 2020, as Appl. No. 16/944,759.
Claims priority of provisional application 62/880,746, filed on Jul. 31, 2019.
Prior Publication US 2021/0035699 A1, Feb. 4, 2021
Int. Cl. H05H 6/00 (2006.01); G21C 3/42 (2006.01); G21G 1/02 (2006.01); G21C 3/20 (2006.01); G21C 21/02 (2006.01); G21C 23/00 (2006.01); G21G 1/00 (2006.01)
CPC H05H 6/00 (2013.01) [G21C 3/42 (2013.01); G21G 1/02 (2013.01); G21C 3/20 (2013.01); G21C 21/02 (2013.01); G21C 23/00 (2013.01); G21G 1/001 (2013.01); G21G 2001/0047 (2013.01); G21G 2001/0068 (2013.01); G21G 2001/0094 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A fissile target material of a nuclear reaction, the fissile target material comprising:
a target substrate, wherein the target substrate comprises a fissile target material including uranium;
a first capturing layer operably interfacing with a surface of the target substrate, the first capturing layer being of a first composition and configured to capture at least one of a first set of predetermined nuclear reaction fission products generated by irradiation of the fissile target material;
a second capturing layer operably interfacing with a surface of the first capturing layer, the second capturing layer being of a second composition and configured to capture at least one of a second set of predetermined nuclear reaction fission products generated by irradiation of the fissile target material, wherein the first composition comprises a different material than the second composition and the first set of nuclear reaction fission products are different from the second set of nuclear reaction fission products; and
wherein the interface between the target substrate and the first capturing layer is configured to allow for the first capturing layer to be removed from the target substrate after irradiation.