US 12,284,484 B2
Microphone chip and microphone
Kaijie Wang, Shenzhen (CN); and Zhuanzhuan Zhao, Shenzhen (CN)
Assigned to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., Shenzhen (CN)
Filed by AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., Shenzhen (CN)
Filed on Nov. 30, 2022, as Appl. No. 18/072,669.
Application 18/072,669 is a continuation of application No. PCT/CN2022/119284, filed on Sep. 16, 2022.
Prior Publication US 2024/0073626 A1, Feb. 29, 2024
Int. Cl. H04R 19/04 (2006.01); H04R 1/08 (2006.01); H04R 7/18 (2006.01); H04R 31/00 (2006.01)
CPC H04R 19/04 (2013.01) [H04R 1/083 (2013.01); H04R 7/18 (2013.01); H04R 31/003 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A microphone chip, comprising:
a substrate having a front cavity; and
a capacitance system disposed on the substrate, wherein the capacitance system comprises a diaphragm disposed on an upper surface of the substrate and a back plate spaced from the diaphragm, and there is an air spacing defined between the diaphragm and the back plate, wherein
the microphone chip further comprises a fixing portion, and the diaphragm and the back plate are respectively connected with the substrate through the fixing portion;
the diaphragm comprises an inner membrane portion, at least one outer membrane portion, and at least one supporting portion, wherein the inner membrane portion and each outer membrane portion define a corresponding gap therebetween, and each of the at least one supporting portion is connected with the fixing portion and the inner membrane portion or is connected with the fixing portion and a corresponding one of the at least one outer membrane portion; and
the microphone chip further comprises a supporting member, and the supporting member is connected with the back plate and is disposed between the back plate and the inner membrane portion; and in response to the microphone chip being in an operating state, the inner membrane portion is adsorbed on the supporting member, and the supporting member is configured to divide the inner membrane portion into at least two regions;
the supporting member comprises a closing portion and a partition portion; in a thickness direction of the microphone chip, the closing portion is disposed above the inner membrane portion and near an outer periphery of the inner membrane portion; the partition portion is connected to an inner circumference of the closing portion.