US 12,284,480 B2
Transducer assembly with buried cavities and method of manufacturing the same
Domenico Giusti, Caponago (IT); Fabio Quaglia, Pizzale (IT); Marco Ferrera, Concorezzo (IT); and Carlo Luigi Prelini, Seveso (IT)
Assigned to STMicroelectronics International N.V., Geneva (CH)
Filed by STMicroelectronics International N.V., Geneva (CH)
Filed on Dec. 14, 2022, as Appl. No. 18/066,148.
Prior Publication US 2024/0205611 A1, Jun. 20, 2024
Int. Cl. H04R 17/00 (2006.01)
CPC H04R 17/00 (2013.01) 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a transducer assembly including:
a substrate having a first surface and a second surface opposite to the first surface;
an array of piezoelectric actuators on the first surface of the substrate;
an array of cavities enclosed within the substrate, each respective cavity of the array of cavities is overlapped by a corresponding piezoelectric actuator of the array of piezoelectric actuators, the array of cavities being closer to the first surface of the substrate than the second surface of the substrate;
a plurality of electrical pathways extend through the substrate from the first surface to the second surface, each respective electrical pathway is coupled to the corresponding piezoelectric actuator of the array of piezoelectric actuators; and
a plurality of first contacts at the second surface of the substrate, each respective first contact of the plurality of first contacts is coupled to a corresponding electrical pathway of the plurality of electrical pathways.