US 12,284,432 B2
Camera module
Sang Yeon Han, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 18/023,129
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Aug. 26, 2021, PCT No. PCT/KR2021/011453
§ 371(c)(1), (2) Date Feb. 24, 2023,
PCT Pub. No. WO2022/045800, PCT Pub. Date Mar. 3, 2022.
Claims priority of application No. 10-2020-0107743 (KR), filed on Aug. 26, 2020.
Prior Publication US 2023/0300437 A1, Sep. 21, 2023
Int. Cl. H04N 23/54 (2023.01); G03B 30/00 (2021.01); H04N 23/52 (2023.01)
CPC H04N 23/54 (2023.01) [G03B 30/00 (2021.01); H04N 23/52 (2023.01)] 20 Claims
OG exemplary drawing
 
1. A camera module comprising:
a circuit board including a cavity;
a first plate including a first region vertically overlapping the cavity and a second region other than the first region;
a second plate disposed on the first region of the first plate and including an opening vertically overlapping at least a part of the cavity;
a first adhesive member disposed on the first region of the first plate and disposed in the opening of the second plate; and
an image sensor disposed on the second plate through the first adhesive member,
wherein a lower surface of the image sensor includes a first portion in direct contact with the first adhesive member and a second portion in direct contact with the second plate.